Abstract
In automated Tape substrate (TS) inspection, machine vision is widely adopted for their high throughput and cost advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting three dimensional defects such as top over-etching. In an attempt to complement vision inspection systems, we proposed utilizing x-ray inspection. To implement x-ray inspection in TS application, we developed a prototype fast and high spatial resolution x-ray imaging sensor which functions at frame rate in excess of 30 fps and has a spatial resolution of 20 µm. In this paper, the development of the sensor and its performance is addressed and the efficiency of the x-ray inspection in detecting top over-etching defects will be shown with experimental studies.
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