Abstract
Abstract The increasing power densities of certain semiconductor devices such as SiC and GaN require higher continuous use temperatures and high thermal properties. For example, one application is for a continuous use temperature of 300°C with SiC devices, with a die attach process at about 370°C. This paper describes development of an Ag/glass die attach paste which demonstrates high performance and reliability, for high temperature continuous use. The Ag/glass paste contains a unique crystallizing glass having a crystalline re-melt temperature of greater than 300°C and less than about 370°C. During the die attach process with Ag/glass paste, the crystallized glass component melts at about 350°C and wets the die and substrate surfaces. During the cool down of the die attach process, the glass crystallizes creating a robust structure having a re-melt temperature greater than 300°C. Therefore, die adhesion remains high for a 300°C continuous use temperature. Another key requirement of a die attach adhesive...
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More From: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT)
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