Development and verification of interfacial fracture energy simulation methodology for porous stacked thin films

Abstract

In view of the fracture failure mechanism induced by low interfacial strength in porous low-dielectric materials, this study establishes an approach based on fracture mechanics theory and finite element simulation to analyze different pore distribution scenarios and interfacial cracks. The study investigates the estimation method of energy release rate for the fracture tip on concerned interfaces with pores and cracks in porous stacked thin films. By incorporating the proposed finite element simulation into J-integral calculations for fracture energy release rate and comparing with previous research, the approach is reliably verified. Subsequently, using the developed simulation approach, cracks and pores in porous materials are analyzed to understand the variations of energy release rates under different structural parameters. Finally, a Monte Carlo method is considered to model porous materials and analyze the fracture energy between dissimilar material interfaces under varying porosity levels. The simulation methodology developed in this study can be applied to estimate the critical value of interfacial fracture energy for corresponding porous materials and heterogeneous material interfaces under external loads. It can serve as a criterion for structural failure assessment.