Abstract

In the current study, it was tried to describe a method for determining thermal characteristics of integrated micro-circuits to identify thermal parameters of multidisciplinary (thermal-electric) behavioral models. The problem is solved on the example of high-frequency pulse voltage converters. A solution was proposed to refine the minimum structure of the thermoelectric model based on an iterative least squares method using the Levenberg-Marquardt algorithm, as well as a graph of the spectral den-sity of time constants. This made it possible to reduce the influence of the filtering factor in the deconvolution operation when building a thermal model using the structural function of the thermal characteristic transition. Also, the results obtained can be used to build integrated circuits (IC) behavioral models, taking into account the thermal processes occurring in them.

Highlights

  • Integrated circuits (IC) of high-frequency switching voltage converters (HFSVC) are widely used in power supplies of any electronic devices that make up the onboard systems of aircraft and spacecraft, household appliances, computers, mobile gadgets, etc

  • Under modern conditions, shortening the development time of electronic devices is impossible without modeling

  • When developing the design of power electronics devices, one of the important tasks of modeling is to take into account the mutual influence of the thermal and electrical characteristics of semiconductor devices and microcircuits, which affects the reliability and performance of the electron ic device as a whole

Read more

Summary

Introduction

Integrated circuits (IC) of high-frequency switching voltage converters (HFSVC) are widely used in power supplies of any electronic devices that make up the onboard systems of aircraft and spacecraft, household appliances, computers, mobile gadgets, etc The area of their use as regulators of constant voltage is constantly expanding due to the development of areas where linear constant-voltage regulators of the compensation type were used previously. The first type of models allows modeling, taking into account many design features, but it requires a larger amount of input data for model compilation as well as a high level of scientific competence of the developer, which is not often observed in engineering practice In this regard, the second type of the model has a number of advantages. Such models of integrated circuits can be successfully implemented in the popular electronic industry languages SPICE, VHDL-AMS, Verilog-A, etc. [9]

Methods
Results
Discussion
Conclusion

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.