Abstract
Current characterization methods of the temperature coefficient of resistance (TCR) of thin films are often limited to slow macroscale measurements, which further require a direct determination of temperature. In this work, we present an innovative application of micro four-point probe (M4PP) sensing, which enables a fast, non-destructive, local measurement of Joule heating effects that can be translated into TCR of the thin film. Analytical expressions for the four-point resistance response to local heating, and ultimately the temperature profile during an M4PP measurement, are derived and validated against finite element models. The method is successfully demonstrated on three metal thin films (7, 10, and 16 nm platinum deposited on fused silica). We evaluate TCR using two different electrode configurations, resulting in unique temperature fields, and observe a measurement repeatability of <2% for each configuration. Furthermore, the M4PP-TCR method shows only a minor (∼18%) systematic offset relative to reference TCR measurements obtained via an independent physical property measurement system. Our results demonstrate a new technique for characterizing TCR on the micrometer scale, adequately backed by theory. The measurement time is just a few seconds and could allow for thin film TCR mapping or in-line process monitoring on test structures.
Highlights
The temperature coefficient of resistance (TCR) is a coefficient of a polynomial approximation of the fractional change in the electrical resistivity ρ of a material upon an incremental change in temperature, validated and applicable within a certain thermal range.[1]
Current characterization methods of the temperature coefficient of resistance (TCR) of thin films are often limited to slow macroscale measurements, which further require a direct determination of temperature
We present an innovative application of micro four-point probe (M4PP) sensing, which enables a fast, non-destructive, local measurement of Joule heating effects that can be translated into TCR of the thin film
Summary
The temperature coefficient of resistance (TCR) is a coefficient of a polynomial (typically linear) approximation of the fractional change in the electrical resistivity ρ of a material (dρ/ρ) upon an incremental change in temperature (dT), validated and applicable within a certain thermal range.[1]. Most recent advances of the past decade include the fabrication of zero-TCR7,8 or tunable-TCR materials.[9,10]
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