Abstract
The effect of the concentration of reducing agent on factors characterizing the operation of the solution, such as stability, copper rate, the plasticity of the obtained metallic copper, due to increased requirements for the plasticity of copper layers deposited from the solutions of chemical copper is studied. The effect of formaldehyde on the deposition rate of copper coatings has been found to be small. The specific orders of the reaction of the formaldehyde copper process in tartrate and trilonate chemical copper solutions are less than one. In tartrate solution, the reaction order is 0.4, in trilonate solution 0.13. The copper rate increases slightly with the concentration of formaldehyde. Taking into account the studied patterns, the main attention in the selection of optimal concentrations of formaldehyde should be paid to the stability of chemical copper plating solutions. In chemical copper solutions, it is recommended to use no more than three times the excess of formaldehyde relative to the concentration of divalent copper.
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