Determination of the atomic cohesive energy and Debye temperature from thermal stiffening of the dielectric constant of semiconductors

Abstract

From the perspective of bond-order-length-strength correlation, we have formulated the thermally stiffened dielectric constant and refractive index for semiconductors. It is clarified that: (i) The dielectric constant and refractive index of semiconductors turn from non-linear to linear thermal stiffening at one third of its Debye temperature; (ⅱ) The Debye temperature determines the width of the non-linear part and the reciprocal atomic cohesive energy determines the slope of linear part at high temperatures of the dielectric constant and refractive index curves.