Abstract
The presence of residual stresses in thermal oxide layers has been recognized for a long time. In the present work, the mechanical fields for chromium oxide are investigated. An extended model is established to take into account the effects of temperature and thermal cycling for the calculation of oxide stress. Numerical results are given in order to predict the influence of different parameters, especially the dependence of some material parameters with temperature. This enables to make comparison with experimental results.
Highlights
When metals or alloys are oxidized at high temperature, an oxide film generally develops
Considering real loadings seen by the material, it is important to take into account the influence of temperature span and temperature rate during heating and cooling, in the modeling
The numerical results are eventually compared with experimental results found in literature
Summary
When metals or alloys are oxidized at high temperature, an oxide film generally develops. Huntz et al.[2] indicate several main possible origins for the growth strain during isothermal oxidation: - the oxygen dissolution in the metal or alloy (incompatibility of the atomic volumes); - the epitaxy (lack of compatibility of the crystalline lattices at interface); - the Pilling and Bedworth approach (incompatibility of the molar volumes); - the possibility that the oxide grows in the oxide grain boundaries These hypotheses are based on incompatibilities of some parameters leading to a stress state in the oxide layer. To obtain the evolution of the stress within the oxide and the metal, it is necessary to consider a derivative form of the continuity relation (Eq 3) that leads to Eq 6: dε dt elastic.
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