Abstract
The presence of residual stresses in thermal oxide layers has been recognized for a long time. In the present work, the mechanical fields for chromia oxide are determined either by XRD or Raman spectroscopy. In addition, the microstructure of the chromia films is investigated ant its influence on the evolution of the stress release processes is analyzed.
Highlights
NiCr alloys are currently used at high temperatures because it develops a dense chromia surface oxide film which slows down the oxidation process
The stress value always provides from the adherent part of the chromia films
It has been shown that the residual stress magnitude in a chromia ceramic film after cooling depends on the growth and thermal source terms and the stress release processes, which appear either during the isothermal domain and during cooling
Summary
NiCr alloys are currently used at high temperatures because it develops a dense chromia surface oxide film which slows down the oxidation process. The isothermal oxide layer growth or the cooling steps usually induce the development of high residual stress in the ceramic film. The determination of such growth or residual stress has already been undertaken [1,2,3,4,5,6,7]. The aim of the present work is a first attempt to evaluate quantitatively the stress release processes in Ni-30Cr alloys To this end, in addition to stress evaluation, the delamination rates (buckling and spalling) will be determined. The influence of different metallurgical parameters (cooling rate, oxidation temperature and duration) which in turn modify the microstructure, will be investigated
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