Determination of high frequency package currents from near-field scan data

Xiaopeng Dong Xiaopeng Dong,T.P Van Doren,Shaowei Deng Shaowei Deng,D.G Beetner,T.H Hubing

doi:10.1109/isemc.2005.1513600

Determination of high frequency package currents from near-field scan data

Xiaopeng Dong Xiaopeng Dong, T.P Van Doren + Show 3 more

https://doi.org/10.1109/isemc.2005.1513600

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Publication Date: Jan 1, 2005

Citations: 3

Affiliation: Missouri University of Science and Technology

#Near-field Scanning #Integrated Circuits Packages + Show 8 more

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Abstract

Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chip-level EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.

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