Abstract
Technical Papers Determination of Fracture Toughness of Thermally Conductive Adhesives E. Jih, E. Jih Ford Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053 Search for other works by this author on: This Site PubMed Google Scholar Y.-H. Pao, Y.-H. Pao Ford Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053 Search for other works by this author on: This Site PubMed Google Scholar X. Song, X. Song Optimal CAE Inc., Novi, MI 48375 Search for other works by this author on: This Site PubMed Google Scholar C. Larner C. Larner Automotive Components Division, Ford Motor Company, Dearborn, MI 48121-2053 Search for other works by this author on: This Site PubMed Google Scholar Author and Article Information E. Jih Ford Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053 Y.-H. Pao Ford Research Laboratory, Ford Motor Company, Dearborn, MI 48121-2053 X. Song Optimal CAE Inc., Novi, MI 48375 C. Larner Automotive Components Division, Ford Motor Company, Dearborn, MI 48121-2053 J. Electron. Packag. Sep 1997, 119(3): 204-207 (4 pages) https://doi.org/10.1115/1.2792235 Published Online: September 1, 1997 Article history Received: July 15, 1996 Revised: March 1, 1997 Online: November 6, 2007
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