Abstract
Electrodeposition of copper from acid sulfate solutions at overpotentials on theplateau of the limiting diffusion current density and at higher overpotentials wasexamined. The average current efficiencies for hydrogen evolution reaction aredetermined by a measurement of the quantity of evolved hydrogen and the overallelectrodeposition current as a function of electrodeposition time, while morphologies ofcopper deposits are examined by the use of the scanning electron microscopy (SEM)technique. It is found that the open and porous structures of copper deposits (denoted andas honeycomb – like copper structures), suitable for electrodes in electrochemical devicessuch as fuel cells and chemical sensors, were reached by electrodeposition processesfrom solutions with the lower concentrations of Cu (II) ions (0.15 M CuSO4 and less in0.50 M H2SO4) at overpotentials outside the plateau of the limiting diffusion currentdensity at which the quantity of evolved hydrogen was enough to change hydrodynamicconditions in the near – electrode layer. The main characteristics of these copperstructures were craters or holes formed primarily due to the attachment hydrogen bubbleswith agglomerates of copper grains between them.
Highlights
Electrodeposition of copper at overpotentials and current densities on the plateau of the limiting diffusion current density has been the subject of much research and the results of these investigations have been summarised [1,2,3,4,5]
The average current efficiencies for hydrogen evolution reaction are determined by a measurement of the quantity of evolved hydrogen and the overall electrodeposition current as a function of electrodeposition time, while morphologies of copper deposits are examined by the use of the scanning electron microscopy (SEM) technique
Electrodeposition of copper from 0.075 M, 0.30 M and 0.60 M CuSO4 in 0.50 M H2SO4, at overpotentials of 550, 650 and 800 mV was examined by the determination of the average current efficiency of hydrogen evolution and the SEM technique
Summary
Electrodeposition of copper at overpotentials and current densities on the plateau of the limiting diffusion current density has been the subject of much research and the results of these investigations have been summarised [1,2,3,4,5]. Copper adherent deposits formed in the initial stage of electrodeposition at high current densities and overpotentials are insufficiently investigated. The aim of this paper it will be to examine the effect of this process on copper electrodeposition at overpotentials on the plateau of the limiting diffusion current density or higher ones. This investigation will be done through the analysis of the effect of different concentrations of copper(II) ions on the hydrogen evolution reaction, and the morphology of copper deposits
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