Copper electrodeposition under a weak magnetic field: effect on the texturing and properties of the deposits

Abstract

The effect of a weak magnetic field (induction of 0.5 to 0.7 mT) on the electrodeposition process and the formation of crystallographic texture, morphology and properties of copper deposits has been considered. Electrodeposition studies were performed using cyclic voltammetry, chronoamperometry, and chronopotentiometry. X-ray texture analysis and scanning electron microscopy observations were used to study the texture and the morphology of the copper deposits. Some of their properties were obtained by measuring their microhardness and reflectivity. The effects of decreasing the rate of copper electrodeposition, enhancing texture formation and refinement of grain aggregates of the surface of copper films under the influence of a weak magnetic field have been evidenced. The interrelation of the texture and morphology of the copper electrodeposit surface with their microhardness and reflectivity have been revealed. The conditions for obtaining copper deposits with enhanced microhardness and reflectivity have been determined. It is shown that the electrochemical deposition with a weak magnetic field is a promising direction for obtaining materials with desired properties, without using strong magnetic fields and adding surfactants to the electrolyte.