DETECTION OF POTENTIALLY UNRELIABLE VLSI BASED ON THE ANALYSIS OF TEMPERATURE-SENSITIVE PARAMETERS

Abstract

The paper discusses methods for non-destructive diagnostic testing of very large scale integration circuits (VLSI) based on the “junction-case” thermal resistance parameter. This parameter is important because VLSI’s failure rate depends on junction temperature, which in turn depends on thermal resistance “junction-case”. There are three known methods for detecting potentially unreliable VLSIs with increased thermal resistance value: 1) non-destructive measurement of thermal resistance; 2) scanning acoustic microscopy; 3) an approach based on the statistical analysis of temperature-sensitive electric parameters. The paper presents advantages and disadvantages of each method. Special attention is paid to statistical analysis of temperature-sensitive electric parameters because this method allows detecting of potentially unreliable VLSIs without using expensive equipment. This method does not require changes in existing measurement programs. Electric parameters, which depend on temperature, are temperature-sensitive parameters. These parameters are useful for detecting VLSIs with deviations from the main batch. This allows decreasing of risk of potentially unreliable VLSIs application in high reliable equipment. With the proposed approach the high reliable equipment lifetime can be increased.