Abstract

Negative Bias Temperature Instability (NBTI) is a degradation phenomenon that occurs in PMOS transistors during circuit lifetime. Recent works have proposed transistor level and circuit level models that allow designers to deal with such phenomenon. Based on these models and taking into account Random Dopant Fluctuation (RDF), we study the possibility of detecting SRAM core-cells that are prone to NBTI failures during post-production test. For this purpose, we introduce a statistical simulation method that allows estimating the amount of NBTI affected core-cells that pass or fail under given test conditions. Supply voltage, temperature, word line pulse width, word line pulse voltage and bit line voltage are the parameters considered as test conditions. An industrial core-cell design with a 65 nm technology is used as case study.

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