Abstract
Summary Surface mount assembly techniques provide a significant advantage at cost, volume, and reliability over the current “thru-hole” technology. These are well documented and the manufacturing equipment and related products are becoming readily available to support new production lines. Also, as experience grows, improved products and ideas are developed from the cooperative efforts of vendors and users in standardization organizations and in problem solving sessions. The broad selection of package types and product technologies available now are sufficient to begin conversion of existing electronic system products for size reduction or feature enhancement. Definitely, new products should be designed with surface mount technology.
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