Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics

Abstract

ABSTRACT The emergence of stretchable electronic technology has led to the development of many industries and facilitated many unprecedented applications, owing to its ability to bear various deformations. However, conventional solid elastomer substrates and encapsulation can severely restrict the free motion and deformation of patterned interconnects, leading to potential mechanical failures and electrical breakdowns. To address this issue, we propose a design strategy of porous elastomer substrate and encapsulation to improve the stretchability of serpentine interconnects in island-bridge structures. The serpentine interconnects are fully bonded to the elastomer substrate, while segments above circular pores remain suspended, allowing for free deformation and a substantial improvement in elastic stretchability compared to the solid substrates. The pores ensure unimpeded interconnect deformations, and moderate porosity provides support while maintaining the initial planar state. Compared to conventional solid configurations, finite element analysis (FEA) demonstrates a substantial enhancement of elastic stretchability (e.g. ≈9 times without encapsulation and ≈ 7 times with encapsulation). Uniaxial cyclic loading fatigue experiments validate the enhanced elastic stretchability, indicating the mechanical stability of the porous design. With its intrinsic advantages in permeability, the proposed strategy has the potential to offer insightful inspiration and novel concepts for advancing the field of stretchable inorganic electronics.