Abstract
A novel design of flat chip-size microchannel heat sink for high power devices cooling is proposed and optimized. The inlet of cooling media is placed in the highest heat flux region, leading the coolest media into the region with the highest temperature directly, and as a result, the overall cooling efficiency is improved. Simultaneously, the collect channel is set and the inlet position is slightly off-center, which achieves a uniform temperature distribution. With the aid of a computational fluid dynamics (CFD) method, the temperature distribution of microchannel heat sink under steady-state conditions is examined and the microchannel distribution is optimized, forming an optimal design for the chip-size microchannel heat sink.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
