Abstract
Abstract A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” Here, a virtual flip chip ball grid array (FC-BGA) is examined in comparison to a reference chip scale package (CSP). The comparison is performed using finite element simulation. A combined measurement-simulation technique is used to calibrate the finite element simulations on a reference object. The adjustment is based on the in-plane deformation field obtained by both simulation and optical measurement. For the latter, an optical sensor is used for in-plane deformation and strain field analysis based on the gray-scale correlation method. The findings obtained can be extrapolated to alternative package types with different but similar design to evaluate their suitability for the desired application before physical fabrication.
Published Version
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