Abstract
Abstract A microfluidic chip requires microchannels to be created on a substrate. This paper focuses on the design and development of a precision hot embossing machine for replication of microstructures on a polymethyl methacrylate (PMMA) substrate. Kinematic coupling using three spherical balls in radial v-grooves is used to achieve precise positioning of the mold insert with the base. Flexure-based parallel guidance mechanism is used for one degree-of-freedom (DOF) motion required for the embossing process. The mechanism allows the motion of the mold normal to the substrate surface. Flexure-based kinematic coupling with the thermal center is designed to mitigate thermal stress build-up during heating and cooling of the mold insert. An Arduino-based microcontroller is developed to control the temperature profile during the process. A prototype is fabricated and experiments are performed with an aluminum mold insert on a PMMA substrate. The result shows the feasibility of the concept and the setup can be used to develop a cost-effective precision hot embossing machine for creating micropatterns for microfluidic applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.