Abstract
In this paper a new design of MEMS capacitive fingerprint sensors is presented. The capacitive sensor is made of two parallel plates with air gap. In these sensors, the capacitance changes is very important factor. It is caused by deformation of the upper electrode of sensor. In this study with making slots in upper electrode, using T-shaped protrusion on diaphragm in order to concentrate the force from finger ridges, making holes in lower electrode to reduce the air damping and using low stress material for diaphragm, we have been succeeded to design a novel MEMS fingerprint sensor with high sensitivity compared with the previous one. In the present research, simulations were carried out using FEA method.
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