Abstract
A novel processing technology based on the functionally graded and composite structured lapping and polishing plate (FG/CS-LPP) is proposed for effectively improving the material removal uniformity. The FG/CS-LPP has the characteristics of required quasi-continuous distribution of Young's modulus in the radial direction and composite structure in the longitudinal direction. Moreover, the certain variation of Young's modulus does not tend to influence the material removal uniformity and two-step processing technique makes the shrinkage deformation of the composites reduce to 0.03 mm. Based on the Preston equation, the FG/CS-LPP can realize smooth inverse proportional stress distribution and make processing parameters decoupling of K (Preston coefficient) and P (contact stress). Through numerical simulation analysis and experimental verification, the designed FG/CS-LPP successfully achieves material removal uniformity on ZrO2 ceramic.
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