Abstract
Non-destructive inspection using ultrasonic sensor array has been widely employed for various objects to detect internal flaws or to characterize materials. The measured objects have different size and shape, so we need to move sensor array along the surface mechanically. This way takes a lot of time to inspect the objects. To solve this problem, we have proposed the conceptual organization of ultrasonic sensor array with scalability and flexibility to any objects to be measured. This paper describes the daisy-chain connection to realize the proposed ultrasonic sensor array in detail. In this structure, several ultrasonic sensor modules that can be adhered to the measured objects are connected by serial communication with flexible connectors can be bending in a daisy chain fashion. If measured objects are huge or the shape is complex, many modules are needed to cover the object surface efficiently. This may cause delay to complete measuring at all modules because outputs of each module are sent to the host PC sequentially. As a preliminary evaluation for the proposed structure, we investigate the relation between the number of the modules and transfer rate from modules to the host computer.
Highlights
Ultrasonic sensors are used in many fields and applications such as detection of target objects and measurement of distance and so on
We have proposed the conceptual organization of ultrasonic sensor array with scalability and flexibility to any objects(4)
We describe the operation in the whole of the instrument and the module to realize the proposed ultrasonic sensor array
Summary
Ultrasonic sensors are used in many fields and applications such as detection of target objects and measurement of distance and so on. The measured objects have different size and shape, so we need to move sensors along the surface mechanically. To solve these problems, we have proposed the conceptual organization of ultrasonic sensor array with scalability and flexibility to any objects(4). Each module is connected by flexible cables, so the whole of the instrument can fit arbitrary objects that have various shape and size. We first explain the organization of the proposed ultrasonic sensor array. In this structure, modules equipped with several ultrasonic transducers that operate as speaker and sensor and processing units are connected in daisy chain fashion. We describe the operation in the whole of the instrument and the module to realize the proposed ultrasonic sensor array. We investigate the relation between the number of the modules and transfer rate from modules to the host computer
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