Abstract
The relevance of magnetron sputtering to obtain conductive metallized coatings with a thickness of up to tens of micrometers is indicated. Attention is paid to the features of magnetron sputtering with a liquid target. It is noted that this process is currently being implemented using magnetrons with size from 3” to 6”. The design flaws of the existing NMSA-52M magnetron and its mounting unit to the chamber of the vacuum coating system MVTU-11-1MS are considered. The design of a magnetic system with an increased value of magnetic induction on a 2” magnetron surface has been developed. The magnetron sputtering source were designed: a housing, a chamber mounting unit and a cover. As a result, a variant of the improved design of the magnetron sputtering source is presented, which takes into account the disadvantages of the existing NMSA-52M magnetron.
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