Abstract

Design and processing considerations pertinent to integrating an audio-frequency, low-noise preamplifier are discussed. Performance characteristics of an integrated circuit "mock-up," an experimental model integrated circuit, and the final design integrated circuit are compared with one another and with the theoretically predicted performance. The wide range of design flexibility and tight performance parameter control attained through use of compatible thin-film/monolithic processing technologies is demonstrated. It is further demonstrated that an overall design approach which considers both the electronic functions to be performed and limitations and advantages of the processing technologies involved can result in integrated circuit performance characteristics which are superior to those of the "discrete component" counterpart.

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