Abstract
Printed Circuit Board (PCB) is a critical component in the IC packaging process. Manufactured PCBs are typically designed for use by a specific kind of chip and cannot be used for multiple chip types. However, allowing different kinds of chips to be served by a single PCB would greatly improve material preparation and production processes. However, the design and manufacturing of PCB for use in multiple chip types raises issues related to minimizing the use of gold wire. Traditional manual methods rely extensively on experience. This paper applies Particle Swarm Optimization (PSO) methods to identify optimal positioning with experimental results showing a 20% reduction of gold wire in multi-use PCB.
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