Abstract
Monolithic 3D ICs (M3D) are an emerging technology that offers an ultra-high-density 3D integration due to the extremely small size of monolithic inter-tier vias. We explore various design styles available in M3D and present design techniques to obtain GDSII-level signoff quality results for each of these styles. We also discuss various challenges facing each style and provide solutions to them.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
