Design and realization of dual band stacked antenna via three‐dimensional printing technology

Abstract

AbstractWith the ever‐increasing demands for high‐performance wireless communication systems, the need of fast and low‐cost realization of antenna stages had also become more crucial for wireless communication industry. Herein, design and low‐cost realization of a three‐dimensional (3D) printed dual band Stacked Microstrip Patch Array (SMPA) antenna has been studied. A 3D electromagnetic‐based simulation model of the proposed SMPA antenna has been created in CST Microwave Studio. The antenna achieves a simulated gain level of almost 8.3 dBi at 5.2 and 10.4 GHz frequencies. Then, the antenna design with optimally selected parameters has been prototyped via the use of 3D printing technology. The prototyped antenna has a measured gain level of 7.2 dBi at the operation frequencies. Furthermore, the experimental results of the prototyped antenna have been compared with the simulated results. From the compared results, it can be concluded that not only the proposed antenna design has achieved high‐performance measures compared with counterpart designs in the literature but also it is possible to achieve an accurate, fast, and low‐cost realization via the use of 3D printing technology.