Abstract

Reduction of Leakage power at nano meter regime has become a challenging factor for VLSI designers. This is owing to the need for low-power, battery-powered portable pads, high-end gadgets and various communication devices. Memories are made up of Static RAM and Dynamic RAM. SRAM has had a tremendous impact on the global VLSI industry and is preferred over DRAM because of its low read and write access time. This research study proposes a new method has been proposed of 6T Static Random Access Memory cell to decrease the leakage current at various technologies. Three source biasing methods are used to minimize the 6T SRAM cell leakage power. The three methods are NMOS diode clamping, PMOS diode clamping and NMOS-PMOS diode clamping at 45 nm and 90 nm technology nodes. This paper also emphasizes on the implementation of 6T SRAM cell using Multiple Threshold CMOS (MTCMOS) technique at 45nm technology. The simulation is achieved and various power dissipations are analyzed at supply voltage of 0.9 V and 0.45 V for 90 nm and 45 nm technology respectively using cadence virtuoso tool. PMOS clamping has shown the reduction in an average power by 82.19% than compared to other two proposed techniques.

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