Abstract
This paper presents a novel multi-sensor with three integrated functions. The multi-sensor has been designed so that the piezoresistive sensor can perceive external vibrations and the capacitive proximity sensor can perceive capacitance changes. In addition, the photodiode sensor can perceive light that has been introduced into the unit by a tamper reaction. A multi-sensor is fabricated on a silicon-on-insulator (SOI) wafer by using tetra-methyl ammonium hydroxide (TMAH) etching, a doping process, a, low-pressure chemical vapor deposition (LPCVD) process, and a micro-machining technique. If the multi-sensor is built into a single-unit system in order to perceive external tampering, the system unit may be configured to give an alarm only when more than two sensors among the three are activated. However, in the case of a mobile unit that always moves, the multi-sensor might be constructed without the piezoresistive sensor so that the proximity sensor and the photodiode sensor can perceive external tampering. Each sensor of the multi-sensor, which is formed independently on a chip, can detect dierent
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