Abstract
To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology) production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.
Highlights
In the SMT (Surface Mount Technology) production process, the solder paste printing on the circuit board is often the first step of the entire SMT production process; the printing is one of the most critical and important processes [1]
Needle dispensing is a useful supplement in Ball Grid Array (BGA) rework, being solder coated, forming 3D graphics, and other aspects of the screen printing
The appearance of the solder paste jetting system is a major breakthrough in the SMT industry
Summary
In the SMT (Surface Mount Technology) production process, the solder paste printing on the circuit board is often the first step of the entire SMT production process; the printing is one of the most critical and important processes [1]. Jetting technology has been widely used in rapid manufacture [9,10], life sciences [11,12,13], electronic fabrication [14,15], and so on due to the fast manufacturing time, high operating flexibility, and low production cost. To use these advantages in small-scale, high-mix electronics solder paste printing, the Swedish company Mycronic developed the first solder paste jetting hiMgihcr-ommaixchineelse2c0tr1o6,n7i,c1s12solder paste printing, the Swedish company Mycronic developed the f2irosft solder paste jetting system [2,16,17]. Hhiogwhepvreers,sfuorre,soinlddeurcpedasbtey, twhheincheeidslae’lsiqimuipda-scotloidn ttwheo-npohzazslee falnudidj,etthtiengsoolduetrtopaprrtoicdluescewaildl broep. crHusohweedvear,nfdor ascoclduemruplaastteed, wuhnicdheris tahleiquimidp-saocltidfotwrcoe-.phTahsaetflwuiidll, thneotsooldnelyr pdaretsitcrloesywtihllebeinctreursnhaeld coamndpoancceunmtsuolfatthede suonlddeerr tphaestiem, pbuacttaflosorcecl.oTghtahtewniollznzolet oornilfyiced.eTsthruoys, tthheeipnrteesrennatl csotumdpyopnreonptossoefstahe soslodledrerpapsatseteje, tbtiuntgaslsyostcelmogdthrievennozbzyleaopriiefizcoee. lTehcturisc, tshtaecpkr,eisnenwthsitcuhday mprionpisocsuelse agasopldexeirsptsabsteetwjeetteinng thseysntoemzzlderaivnednnbeyeadlpeieinzsoteelaedctroifc tshtaecnke, eindlwe hhiicthtinagmthineisncouzlezlgeadpireexcistltys.bFeutwndeeanmtehnetanloezqzuleaatinodnsnaeenddle siimnsutleaatdionofatnhaelynseisedbyleFhLiUttiEnNgTthseofntwozazrlee(vd6ir.3e.c2t6ly).foFrutnhdeajemtteinngtaslyesqteumatiaornesparnesdenstimedutloateioxpnraenssaltyhseis crbityicFaLl UjetEeNjeTctsioonftwvealroeci(tvy6..T3.h2e6n),ftohrethperojetotttiynpgesoyfsttheme saorlde eprrpesaesntetejedtttiongexspyrsetessmthweacsrfiatibcrailcjaetteedj,eacntidon thveeploecriftoyr. mThanence, twheasptrhoetontvyepreifoiefdthbeyseoxldpeerripmaesntetsj.etting system was fabricated, and the performance was verified by experiments
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