Design and characterization of a silicon piezoresistive three-axial force sensor for micro-flapping wing MAV applications

Abstract

This paper describes the design and electro-mechanical characterizations of a three-axial micro piezoresistive force sensor fabricated by microelectromechanical systems (MEMS) technologies. This is the first three-axial MEMS micro force sensor applied to the study of Micro Aerial Vehicle (MAV) aerodynamics. A standard dry etching fabrication process using Silicon On Insulator (SOI) wafer is employed to fabricate the multi-axis sensors. Conventional cross-beam structure is employed. There are eight piezoresistors on the beams, and each of the silicon strain gauge size is 15 μm in width, and between 400 and 500 μm in length. The Finite Element Method (FEM) analysis for confirming the piezoresistors attachment locations is performed. The miniaturized force sensor (11×11 mm²) is attached at the wing base of a micro flapping wing system (MAV, 70×30 mm² ) by a short pillar. The sensor is designed to detect the dynamic drag force and lift force generated by a single wing under a moderate flapping frequency (5~10Hz) simultaneously. The characterizations are experimentally investigated. The sensor should be stiff enough to withstand the high inertial force (200 millinewton) and also has high resolution to detect the minimal force correctly. Measurements show that the resolution is on the order of a millinewton. High linearity and low hysteresis under normal forces and tangential forces are demonstrated by applying forces from 0 to 0.1 N. The micro flapping wing mechanism and the assembly of wing and sensor are also discussed in this paper.