Abstract
The reaction of Os3(CO)12 with 1.2 eq. of pyrazole (3,5-(CF3)2-pz)H at 190 °C affords triosmium complex Os3(CO)10(3,5-(CF3)2-pz)(μ-H) (1) as the isolable product. Upon further treatment with excess pyrazole (3,5-(CF3)2-pz)H under more forcing conditions, complex 1 converts to a diosmium pyrazolate complex [Os(CO)3(3,5-(CF3)2-pz)]2 (2) in high yield. These osmium complexes are characterized by spectroscopic methods and single crystal X-ray diffraction study, showing the expected triangular and linear Os–Os backbone and with one and two bridging pyrazolate ligands for complexes 1 and 2, respectively. The thermal properties are studied by TG analysis and the deposition experiments are carried out using a cold-wall CVD apparatus. The as-deposited thin films are characterized using XPS, XRD and SEM and electrical resistivity measurement. It seems that the Os metal thin films are best deposited at an optimal temperature of 450–500 °C and using complex 2 as the source reagent.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
