Abstract
Glass is a well-known non-conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well-known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser-induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.
Highlights
Various deposition techniques on different materials, such as metallic melts [1], spray deposition [2], and chemical vapor deposition [3] have been widely studied over time
Several methods have been studied for combining conductive materials with glass, such as using indium tin oxide (ITO) [8,9], femtosecond laser deposition [10,11], electroless copper plating [12,13,14,15], and laser-induced chemical liquid phase deposition (LCLD) [16,17,18,19]
Sulfate pentahydrate solution was used instead of a mentioned in Section 2.2, 0.05 M CuCl2 was chosen for LCLD for its better topology of deposited
Summary
Various deposition techniques on different materials, such as metallic melts [1], spray deposition [2], and chemical vapor deposition [3] have been widely studied over time. Several methods have been studied for combining conductive materials with glass, such as using indium tin oxide (ITO) [8,9], femtosecond laser deposition [10,11], electroless copper plating [12,13,14,15], and laser-induced chemical liquid phase deposition (LCLD) [16,17,18,19]. ITO technology involves selectively removing sputtered ITO from the surface of glass by wet etching or with a laser device [8], and femtosecond laser deposition is a selective electroless deposition method using femtosecond lasers on light-reactive glass [11], but these techniques require. Electroless copper plating and LCLD are more widely used because of process simplicity and cost-effectiveness [16]
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