Abstract
The direct deposition of diamond films on copper substrate has been suffered from adhesion problems due to the mismatch of the thermal expansion coefficients of diamond and copper. In this paper, nuclei with valuable density were directly introduced through a submicron diamond powder layer. The diamond grits partially were buried in the copper substrate leading to better adhesion. Another method with nickel intermediate layer for enhancing the adhesion was studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate and Ni interlayer might contribute to the adhesion improvement. The quality of the diamond films deposited with nickel interlayer was investigated by scanning electron microscopy and Raman spectroscopy.
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