Abstract

The use of a Mo–N barrier for solution-processed CIGS results in reduced MoSe2 formation. This enabled longer selenization time, enhanced grain growth and performance.

Highlights

  • Chalcopyrite Cu(In,Ga)Se2 (CIGS) solar cells are today a wellestablished and robust thin lm photovoltaic (PV) technology with laboratory-level efficiencies exceeding 22%.1 CIGS modules with stable power output are commercially available

  • The sheet resistance of the bilayer increased with increased sputtering pressure, while it remained relatively constant with varying nitrogen content of the Mo–N layer

  • The composition of the CIGS absorber through its depth is relatively constant, with overall [Cu]/[Ga + In] (CGI) and [Ga]/[Ga + In] (GGI) ratios of approximately 0.8 and 0.27 respectively

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Summary

Introduction

Various back contact diffusion barriers, including metal oxides and nitrides have been studied in order to prevent Se diffusion to the back contact of the CIGS/CZTS solar cell. Following the ideology of the IBM method, Brutchey et al effectively dissolved a series of V2VI3 chalcogenides, using a diamine–dithiol solvent mixture instead of hydrazine.[20] Our group employed this solvent mixture to readily dissolve Cu2S, In2S3 as well as Ga/Se precursors These solutions were used to fabricate CuIn(S,Se)[2] (CIS) and Cu(In,Ga)(S,Se)[2] (CIGS) thin lm solar cells in ambient air conditions with PCEs reaching 8% and 9.8% respectively.[21] Among other groups using the same solvent combination, Wu et al successfully dissolved pure metals (Cu, In, Ga) leading to a 9.5% efficient CIGS solar cell.[22] Agrawal et al used a similar solvent structure, monoamine–dithiol, resulting in a pure selenide 12.2% efficient CIGSe.[23] This was achieved in a controlled environment of a nitrogen- lled glovebox and using spin-coating which is a difficult technique to scale and not industrially relevant.

Mo–N layer deposition optimisation
Mo–N as a diffusion barrier
4.58 Â 10À2
Experimental section
CIGS solar cell fabrication
CIGS precursor solution preparation and absorber layer deposition
Conclusions
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