Abstract
High-pressure cold spray (HP-CS) was used to deposit aluminum onto polyetherketoneketone (PEKK) composite substrates. Aluminum powders were sprayed using N2 and He carrier gas and a bond layer (BL) of commercial-purity Al (CP Al). Dense 7075 and CP Al deposits were achieved via combinations of BL-N2, 7075/BL-N2, and 7075/BL-He. Cold spray using 7075 Al particles or using He carrier gas yielded thinner deposits because of self-erosion and bond layer erosion. Substrate roughening was more severe when using He gas and generated more polymer debris at the deposit–substrate interface, yielding lower adhesive strength values between the deposit and the composite substrates. Adhesive strength depended on the bonding of initial particle layers that fused with the substrate.
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