Dependence of Electron Beam Diameter, Electron Energy, Resist Thickness and Resist Type for Forming Nano−sized Dot Arrays in EB Lithography by Using Monte Carlo Simulation.

Abstract

We have calculated the electron energy deposition distribution in Calixarene negative resist and analyzed the development profile in order to improve the resolution of pattern. From the trajectories and energy deposition distribution in resist at various beam diameters, it is obvious that the thinner resist film should be adopted for formation of very fine dots. The analysis of relationship between the thickness of resist and dot diameter based on the critical energy densities shows that the thickness of resist less than 20 nm can obtain 5-nm size dot pattern at the range of critial energy of 6.25 keV/cm3-56.25 keV/cm3. The simulation of resist development profile indicates that dot size of 3 nm can even be obtained at a higher critical energy density at 156.25 keV/ cm3. Furthermore, Calixarene resist is more suitable than PMMA positive resist by comparison of these two resists