Abstract
Tungsten-Copper (WCu) composites are promising materials for electrical and thermal applications. However, their fabrication remains limited using conventional techniques, such as powder metallurgy, which are not suitable for manufacturing densified complex WCu components. In this work, laser additive manufacturing (LAM) technology was introduced for fabricating W-25 wt%Cu composites. A densified WCu composite, free of apparent cracks and pores, is successfully synthesized using optimum process parameters of laser power 2000 W and laser scan speed 360 mm/min in an Ar atmosphere with less than 10 ppm O. The densification of WCu composites is owing to the sufficient wetting of solid W particles by the molten liquid Cu and the surface smoothing of the W particles. The good wetting of the solid W particles by the liquid Cu is due to the low oxygen content and the combined effect of increased capillary force and reduced friction force. The W grains are rounded, indicating some solution-reprecipitation of sharp particle edges originating from the increase in solubility from curvature effects.
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