Densification of chemical vapor deposition silicon dioxide film using oxygen radical oxidation

Abstract

Silicon dioxide (SiO2) films formed by chemical vapor deposition (CVD) were treated with oxygen radical oxidation using Ar/O2 plasma excited by microwave. The mass density depth profiles, carrier trap densities, and current-voltage characteristics of the radical-oxidized CVD-SiO2 films were investigated. The mass density depth profiles were estimated with x ray reflectivity measurement using synchrotron radiation of SPring-8. The carrier trap densities were estimated with x ray photoelectron spectroscopy time-dependent measurement. The mass densities of the radical-oxidized CVD-SiO2 films were increased near the SiO2 surface. The densities of the carrier trap centers in these films were decreased. The leakage currents of the metal-oxide-semiconductor capacitors fabricated by using these films were reduced. It is probable that the insulation properties of the CVD-SiO2 film are improved by the increase in the mass density and the decrease in the carrier trap density caused by the restoration of the Si-O network with the radical oxidation.