Demonstration of ultra-thin buried oxide germanium-on-insulator MOSFETs by direct wafer bonding and polishing techniques

Abstract

The ultra-thin body and ultra-thin buried-oxide (UTBB) Germanium-on-Insulator (GeOI) substrates have been fabricated by direct wafer bonding and polishing techniques. The Ge and BOX layer thicknesses are as thin as 9 and 13 nm, respectively. The UTBB GeOI substrates exhibit superior crystal quality (similar to the bulk single crystalline Ge) and sufficiently reduced surface roughness. As a result, the Hall hole mobility of UTBB GeOI reaches 1330 cm2/V s with a carrier concentration of 2 × 1016 cm−3. The inversion mode UTBB GeOI nMOSFETs have also been demonstrated with suppressed mobility degradation during Ge layer thinning, indicating the feasibility of this GeOI substrate formation technique in future CMOS technologies.