Demonstration of MOCVD based in situ etching of β-Ga2O3 using TEGa

Abstract

In this work, we demonstrate an in situ etch technique for β-Ga2O3 inside a metalorganic chemical vapor deposition (MOCVD) reactor using triethylgallium (TEGa) as the etching agent. At sufficiently high substrate temperatures (Tsub), TEGa is introduced into the MOCVD reactor which undergoes pyrolysis, resulting in the deposition of Ga on the β-Ga2O3 surface. These Ga adatoms react with Ga2O3 to form gallium suboxide (Ga2O), which desorbs from the β-Ga2O3 surface resulting in the etching of the epilayer. MOCVD chamber parameters such as TEGa molar flow rate, substrate temperature, and chamber pressure were shown to be key in controlling the etch rate and surface morphology. A wide range of etch rates from ∼0.3 to 8.5 μm/h is demonstrated by varying the etch parameters. In addition, smooth surface morphology on (010) and (001) β-Ga2O3 substrates is also demonstrated. This new etch technique could enable damage free fabrication of 3D structures like fins and trenches, which are key components in many β-Ga2O3 device structures.