Demonstration of a lateral p-NiO/n-GaN JFET fabricated by selective-area regrowth

Abstract

In this paper, we demonstrated experimentally a lateral GaN-based junction field effect transistor (JFET). A selective area regrowth of p-NiO on the as-grown n-GaN channel layer was developed by magnetron sputtering at room temperature to form the p–n junction. A self-aligned gate process and a post metal annealing process were employed to improve the device performances. The measured results show that the annealed JFET exhibits an ON/OFF ratio exceeding 106 and a higher breakdown voltage up to 814 V without any terminal structure. The breakdown voltage is determined by the reverse breakdown of parasitic PN junction between gate and drain. Further, the threshold voltage of the p-NiO/n-GaN JFET exhibits excellent temperature stability in the range of 300–500 K.