Abstract
The present paper reports characterization of the defects in ultrathin (∼10 nm) oxides grown by low-temperature (850°C) thermal oxidation of hydrogen plasma hydrogenated (100)Si and (111)Si substrates. Electrically active defects, studied by analyzing the frequency dispersion of the capacitance-voltage (C-V) and conductance-voltage (G-V) characteristics are dominated by distinct defects, related to interface traps with different localized energy levels in the Si bandgap, border traps and bulk Si traps. Precursors of the trapping centers are defects in a thin, less dense Si surface region containing voids, which is formed during hydrogenation and is incorporated into the growing oxide layer. Oxidation-induced stress level, evaluated from ellipsometric and electroreflectance data analysis, is in the order of 108 N/m2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.