Abstract
To study the role of chemical composition on the resistivities of grains and grain boundaries (GB) for dilute Fe-alloyed Cu thin films, Cu films with grain sizes varying over three orders of magnitude and compositions of 0.025 and 0.25 at.% Fe were prepared by magnetron co-sputtering. Character, morphology and compositions of bulk and GBs were studied using electron backscatter diffraction, transmission electron microscopy and atom probe tomography, respectively. The specific resistivities of both individual GBs and within grains were obtained through local electrical measurements assisted by micromanipulation in situ within a scanning electron microscope. In addition, global resistivity characterisation of the thin films allowed for calculation of the GB reflection coefficient. A decoupling of GB and grain interior resistivities is found with alloying, where the GB resistivity increases by an order of magnitude while the grain interior is affected only to a minor extent in comparison.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.