Abstract
In this investigation, the fabrication of thermal conductive epoxy composite with the assimilation of synthesized expanded graphite (EG) decorated with copper compound nanoparticles [copper (Cu), copper(II) oxide (CuO) and copper(I) oxide (Cu2O) nanoparticles], has been reported wherein, Cu-compound was attached to EG surface by solid-state pyrolysis of copper(II) acetate (CA) monohydrate. The prepared hybrid filler was characterized by an x-ray diffraction technique and the Cu-compound nanoparticles size was 40.8 ± 17.67 nm. The microstructure and morphology of the distributed Cu-compound nanoparticles over the EG surface were characterized by transmission electron microscopy (TEM) and scanning electron microscopy. The Cu-compound nanoparticles decorated EG hybrid filler at 10 wt.% loading ((EG-CA (4)/Ep)10) demonstrated the thermal conductivity (TC) which is 11.8 times higher than the neat epoxy due to the formation 3D percolation heat-conducting networks. Further, decoration of Cu-compound on the EG surface resulted in higher TC as measured using a guarded heat flow meter technique. Lap shear strength of (EG-CA (4)/Ep)10 composite was tuned to 5.93 ± 0.27 MPa as characterized by a universal testing machine. The porosity of fabricated composites was decreased as Cu-compound attachment increases on the EG substrate. The thermo-gravimetric analysis revealed enhanced thermal stability of (EG-CA (4)/Ep)10 composite to 407°C at 50% weight loss consideration. The electrical resistivity of the composite was reduced with the addition of the EG filler system as confirmed from the super megaohmmeter.
Published Version
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