Abstract

We present the recently developed technique of Dark Field X-Ray Microscopy that utilizes the diffraction of hard X-rays from individual grains or subgrains at the (sub)micrometre- scale embedded within mm-sized samples. By magnifying the diffracted signal, 3D mapping of orientations and strains inside the selected grain is performed with an angular resolution of 0.005o and a spatial resolution of 200 nm. Furthermore, the speed of the measurements at high- intensity synchrotron facilities allows for fast non-destructive in situ determination of structural changes induced by annealing or other external influences. The capabilities of Dark Field X- Ray Microscopy are illustrated by examples from an ongoing study of recrystallization of 50% cold-rolled Al1050 specimens.

Highlights

  • Current methods for microstructural mapping such as Electron Back-Scatter Diffraction (EBSD [1]) and standard Transmission Electron Microscopy (TEM [2]) are inherently two-dimensional (2D) and can not directly map the microstructure of bulk materials

  • We present the recently developed technique of Dark Field X-Ray Microscopy that utilizes the diffraction of hard X-rays from individual grains or subgrains at themicrometrescale embedded within mm-sized samples

  • By magnifying the diffracted signal, 3D mapping of orientations and strains inside the selected grain is performed with an angular resolution of 0.005o and a spatial resolution of 200 nm

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Summary

Introduction

Current methods for microstructural mapping such as Electron Back-Scatter Diffraction (EBSD [1]) and standard Transmission Electron Microscopy (TEM [2]) are inherently two-dimensional (2D) and can not directly map the microstructure of bulk materials. We present the recently developed technique of Dark Field X-Ray Microscopy that utilizes the diffraction of hard X-rays from individual grains or subgrains at the (sub)micrometrescale embedded within mm-sized samples. By magnifying the diffracted signal, 3D mapping of orientations and strains inside the selected grain is performed with an angular resolution of 0.005o and a spatial resolution of 200 nm.

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