Damage Characteristics of the Logical Chip Module Due to Plasma Created by Hypervelocity Impacts**supported by National Natural Science Foundation of China (Nos. 10972145, 11272218, 11472178), Program for Liaoning Excellent Talents in University of China (No. LR2013008), Open Foundation of Key Laboratory of Liaoning Weapon Science and Technology, Liaoning Province Talents Engineering Projects of China (No. 2012921044)

Abstract

To researching the damage characteristics of typical logical chip modules in spacecraft due to plasma generated by hypervelocity impacts, we have established a triple Langmuir probe diagnostic system and a logical chips measurement system, which were used to diagnose plasma characteristic parameters and the logical chip module's logical state changes due to the plasma created by a 7075 aluminum projectile hypervelocity impact on the 2A12 aluminum target. Three sets of experiments were performed with the collision speeds of 2.85 km/s, 3.1 km/s and 2.20 km/s, at the same incident angles of 30 degrees and logical chip module's positions by using a two-stage light gas gun loading system, a plasma characteristic parameters diagnostic system and a logical chip module's logical state measurement system, respectively. Electron temperature and density were measured at given position and azimuth, and damage estimation was performed for the logical chip module by using the data acquisition system. Experimental results showed that temporary damage could be induced on logical chip modules in spacecraft by plasma generated by hypervelocity impacts under the given experimental conditions and the sensors' position and azimuth.