Abstract
Lifetime modeling is an essential tool for ensuring the reliability of systems. The purpose is to estimate the time before the power electronic device failure so that downtime can be reduced and costly failures can be avoided in industry. This paper will first quantify the cumulative damage in the power cycling test using Junction Temperature Swing and Maximum Junction Temperature, and then formulate the cumulative damage-based lifetime model of power electronic devices. This model assumes that the lifetime is linear to the inverse of the cumulated damage, and shows superior performance in experiments compared with the well-known LESIT model.
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