Abstract

An analysis of the MOS Transistor with bias between the source and substrate has shown that when the surface is weakly inverted, the silicon space charge capacitance over a wide range of temperature and bias can be obtained from the change in gate voltage required to maintain a constant channel current. The substrate impurity profile beneath the gate oxide can then be calculated from capacitance-bias measurements. Measurements made on n-channell and p-channel transistors following the growth of a thick gate oxide indicate a segregation coefficient of ⋍ 0·3 and ⋍ 100 for boron and phosphorus respectively.

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